TAPES3

Key Info

Basic Information

Partner:
Dr. Serhiy Danylyuk
Faculty:
Mechanical Engineering
Pillar:
Joint Technology Initiatives
Project duration:
01.10.2018 to 30.09.2021
EU contribution:
28.196.295,22 euros
 

Title

Technology Advances for Pilotline of Enhanced Semiconductors for 3nm

Concept

In line with industry needs, Moore’s law, scaling in ITRS 2013, and ECSEL JU MASP 2017, the main objective of the TAPES3 project is to discover, develop and demonstrate lithographic, metrology, EUV mask technology, devices and process modules enabling 3nm node technology. This is planned with available EUV/NA 0.33 scanners, and with system design and integration of a new hyper NA EUV lithography tool to enable more single exposure patterning at 3nm to create complex integrated circuits. Process steps for 3D devices as alternative to the conventional FINFet will be explored for application in the 3nm node. The impact of the application of these so called 3D devices on circuit topology and logic design will be explored. During the development, specific challenges in metrology for the characterization of 3D devices will be assessed and metrology tools will be newly developed. The result will be demonstrated in the imec pilot line.

Participants

  • ASML Netherlands B.V., Netherlands (Coordinator)
  • Applied Materials Belgium, Belgium
  • Applied Materials Israel Ltd., Israel
  • Advanced Mask Technology Center GmbH & Co. KG, Germany
  • Coventor SARL, France
  • DEMCON Advanced Mechatronics B.V., Netherlands
  • FEI Electron Optics B.V., Netherlands
  • Fraunhofer-Gesellschaft zur Förderung der Angewandten Forschung e.V., Germany
  • Ion Beam Services, France
  • Interuniversitair Micro-Electronica Centrum, Belgium
  • Institut für Mikroelektronik Stuttgart, Germany
  • JSR Micro NV, Belgium
  • KLA-Tencor Corporation (Israel), Israel
  • Lam Research AG, Austria
  • Mentor Graphics Belgium, Belgium
  • Nova Measuring Instruments, Israel
  • Oxford Instruments Nanotechnology Tools Ltd., United Kingdom
  • optix fab GmbH, Germany
  • Paul Scherrer Institut, Switzerland
  • Physikalisch-Technische Bundesanstalt, Germany
  • RECIF Technologies, France
  • Siltronic AG, Germany
  • SÜSS MicroTec Photomask Equipment GmbH & Co. KG, Germany
  • Nederlandse Organisatie Voor Toegepast Natuurwetenschappelijk Onderzoek TNO, Netherlands
  • VDL ETG Technology & Development B.V., Netherlands
  • Carl Zeiss SMT GmbH, Germany